Company Filing History:
Years Active: 2025
Title: Willmar Subido: Innovator in Microelectronic Packaging
Introduction
Willmar Subido is a notable inventor based in San Jose, CA, specializing in microelectronic packaging technologies. He has made significant contributions to the field, particularly in developing solutions that enhance the performance and reliability of microelectronic devices.
Latest Patents
Willmar Subido holds a patent for "Wire bond wires for interference shielding." This invention relates to apparatuses designed to protect microelectronic packages from interference. The patent describes a substrate with a ground plane, where a first microelectronic device is coupled to the upper surface. Wire bond wires are strategically positioned to conduct interference to the ground plane while providing a shielding region for the first microelectronic device. This innovative approach ensures that the second microelectronic device, located outside the shielding region, remains unaffected by interference.
Career Highlights
Willmar Subido is currently employed at Adeia Semiconductor Technologies LLC, where he continues to work on advancing microelectronic technologies. His expertise in the field has led to the development of innovative solutions that address critical challenges in microelectronics.
Collaborations
Throughout his career, Willmar has collaborated with talented individuals such as Abiola Awujoola and Zhuowen Sun. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Willmar Subido's contributions to microelectronic packaging through his patented inventions highlight his role as a key innovator in the industry. His work continues to influence the development of reliable and efficient microelectronic devices.