Gammelstad, Sweden

Willis Rudolf Forsling

This inventor holds 1 USPTO granted patent. Top assignee: Cuptronic Ab. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Willis Rudolf Forsling. Retrieved from https://idiyas.com/inventor/willis-rudolf-forsling

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Innovations by Willis Rudolf Forsling

Introduction

Willis Rudolf Forsling is an accomplished inventor based in Gammelstad, Sweden. He has made significant contributions to the field of circuit board technology through his innovative methods. His work focuses on applying metal layers in distinct patterns, which has implications for the production of high-resolution circuit boards.

Latest Patents

Forsling holds a patent for a method of applying metal layers in distinct patterns. This method utilizes a photoinitiator and UV-light to selectively inoculate suitable monomers on the surface of a non-conducting substrate. The metal ions are absorbed by these monomers and subsequently reduced. This fully additive method allows for the production of circuit boards with high resolution and enables the creation of functional components directly on a non-conducting substrate. He has 1 patent to his name.

Career Highlights

Forsling is associated with Cuptronic AB, where he continues to develop and refine his innovative techniques. His work has positioned him as a notable figure in the field of electronics and circuit design.

Collaborations

He has collaborated with notable colleagues, including Karl-Gunnar Larsson and Alf Lage Pettersson, contributing to advancements in their shared field of expertise.

Conclusion

Willis Rudolf Forsling's innovative methods in applying metal layers have the potential to revolutionize circuit board production. His contributions are significant in advancing technology in this area.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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