Company Filing History:
2 out of 164,219 
2 out of 4,159 
Years Active: 2010-2017
Title: The Innovations of Willie Theodore Davis, Jr.
Introduction
Willie Theodore Davis, Jr. is a notable inventor based in Raleigh, NC (US). He has made significant contributions to the field of electronics, holding a total of 4 patents. His work primarily focuses on improving the efficiency and effectiveness of electronic assembly processes.
Latest Patents
One of his latest patents is titled "Sensor-based removal of a soldered device." This innovative apparatus includes a grip mechanism of a rework nozzle designed to grip an electrical component soldered to a printed circuit board. The apparatus features a spring that moves beyond a minimum threshold when the solder begins to melt, allowing for precise removal of components. Additionally, the apparatus is equipped with sensors that detect this movement and communicate activation signals accordingly.
Another significant patent is the "Method to improve strain rate control of small lead-free printed circuit board assembly during in-circuit test process." This invention includes a top plate and an extension card that surrounds a space for a small electronic assembly. The design allows for test probes to contact both the extension card and the electronic assembly, ensuring accurate testing during the assembly process.
Career Highlights
Throughout his career, Willie has worked with prominent companies such as IBM and Lenovo (Singapore) Pte. Ltd. His experience in these organizations has contributed to his expertise in electronic assembly and testing technologies.
Collaborations
Willie has collaborated with several talented individuals, including Michk Huang and Larry G. Pymento. These partnerships have likely enhanced his innovative capabilities and contributed to his successful patent applications.
Conclusion
Willie Theodore Davis, Jr. is a distinguished inventor whose work has significantly impacted the field of electronics. His innovative patents demonstrate his commitment to advancing technology and improving electronic assembly processes.