The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
Dec. 22, 2005
Willie T. Davis, Jr., Raleigh, NC (US);
Todd D. Fellows, Raleigh, NC (US);
Larry D. Gross, Cary, NC (US);
Willie T. Davis, Jr., Raleigh, NC (US);
Todd D. Fellows, Raleigh, NC (US);
Larry D. Gross, Cary, NC (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Methods and arrangements to attach a QFN to a PCB, systems which include a QFN attached to a PCB, and apparatuses for controlling the deposit of solder upon a PCB are disclosed. Embodiments include transformations, code, state machines or other logic to calculate a total area for the QFN IO pads. Embodiments may then determine a total area for the regions of solder applied to the PCB thermal pad to which the QFN thermal pad may be connected in dependence upon the calculated total area for the QFN IO pads. In some embodiments, the total area of the solder regions applied to the PCB thermal pad is approximately equal to the calculated total area for the QFN IO pads. In many embodiments, the number of regions of solder and the shape of the regions of solder is determined.