Alameda, CA, United States of America

William Yeh

This inventor holds 2 USPTO granted patents. Top assignees: Salesforce Com, Inc., Salesforce, Inc.. Active years: 2022-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William Yeh. Retrieved from https://idiyas.com/inventor/william-yeh-jt4ekfqc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022-2024

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2 patents (USPTO):Explore Patents

Title: Innovations by William Yeh

Introduction

William Yeh is an accomplished inventor based in Alameda, CA (US). He holds 2 patents that showcase his expertise in data packaging and management. His innovative approaches have contributed significantly to the field of data technology.

Latest Patents

William Yeh's latest patents include "Techniques for Data Package Generation" and "Data Stream Packaging." The first patent describes a method for generating a data package for deployment in a target database environment. This method involves receiving a request to generate a data package, determining a related set of data objects, and transmitting this information to a user interface. The second patent outlines methods, systems, and devices for data packaging at an application server. It details how a device can receive a link to a data stream package, install it, and import streaming data according to a defined schedule.

Career Highlights

Throughout his career, William has worked with notable companies such as Salesforce.com, Inc. and Salesforce, Inc. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in data management technologies.

Collaborations

William has collaborated with talented individuals such as Sahil Bhutani and Naveen Singh Jaunk. These partnerships have fostered innovation and creativity in his projects.

Conclusion

William Yeh's contributions to data packaging and management through his patents reflect his dedication to innovation in technology. His work continues to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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