Federal Way, WA, United States of America

William T Williams, Iii

This inventor holds 1 USPTO granted patent. Top assignee: The Boeing Company. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William T Williams, Iii. Retrieved from https://idiyas.com/inventor/william-t-williams-iii

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: The Innovations of William T. Williams, III

Introduction

William T. Williams, III is an accomplished inventor based in Federal Way, WA. He has made significant contributions to the field of materials engineering, particularly in the area of titanium forming technologies. His innovative approach has led to the development of a unique method that enhances the capabilities of titanium assemblies.

Latest Patents

William holds a patent for a method titled "Superplastic forming of titanium assemblies." This patent describes a technique that allows for the superplastic forming of titanium packs, which can include sheets with varying granular structures. These sheets are designed to superplastically form at different temperatures, enabling one or more sheets to be formed at temperatures below the superplastic forming temperature of another sheet in the pack. This innovation can reduce or eliminate the occurrence of markoff, thereby improving the overall quality of the titanium assemblies.

Career Highlights

William T. Williams, III is currently employed at The Boeing Company, where he applies his expertise in materials science to advance aerospace technologies. His work at Boeing has positioned him as a key player in the development of innovative solutions that enhance the performance and reliability of aircraft components.

Collaborations

Throughout his career, William has collaborated with notable colleagues, including Kent W. Dunstan and Peter N. Comley. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the pursuit of groundbreaking innovations.

Conclusion

William T. Williams, III exemplifies the spirit of innovation in the field of materials engineering. His contributions, particularly in the superplastic forming of titanium assemblies, highlight the importance of advancing technology for practical applications. His work continues to influence the aerospace industry and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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