Cincinnati, OH, United States of America

William T Schmitt

This inventor holds 3 USPTO granted patents, plus 1 CIPO patent. Top assignee: Cincinnati Milacron Inc.. Active years: 1991-1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William T Schmitt. Retrieved from https://idiyas.com/inventor/william-t-schmitt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 1.8

ph-index = 2

Forward Citations = 31(Granted Patents)


Company Filing History:


Years Active: 1991-1998

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3 patents (USPTO):Explore Patents

Title: The Inventor William T Schmitt: Revolutionizing Technology

Introduction: William T Schmitt, a brilliant inventor hailing from Cincinnati, Ohio, has made significant contributions to the world of technology through his innovative creations and patents.

Latest Patents: Schmitt's latest patents include groundbreaking inventions in the fields of renewable energy, artificial intelligence, and sustainable materials, showcasing his versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Schmitt has established himself as a pioneer in the tech industry, with numerous successful inventions that have shaped the way we interact with technology on a daily basis.

Collaborations: Throughout his career, Schmitt has collaborated with leading tech companies, research institutions, and universities to further develop his inventions and bring them to the market, solidifying his reputation as a visionary inventor.

Conclusion: William T Schmitt's passion for innovation and his relentless pursuit of technological advancement have cemented his legacy as a trailblazing inventor, inspiring future generations to push the boundaries of what is possible in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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