William T Pulz

Title: William T Pulz: Innovator in Semiconductor Technology

Introduction

William T Pulz is a notable inventor based in Cary, NC (US), recognized for his contributions to semiconductor technology. With a total of 3 patents, he has made significant advancements in the field, particularly in the area of polymer materials and die attach metallization.

Latest Patents

One of his latest patents is titled "Polymer via plugs with high thermal integrity." This invention focuses on providing via plugs in vias of semiconductor materials. The via plugs are made from polymers, such as polyimide, which can endure high soldering and operating temperatures. This innovation effectively prevents solder from filling the vias during subsequent soldering processes. Another significant patent is "Wafer-level die attach metallization." This patent describes a semiconductor wafer that features wafer-level die attach metallization on its back-side. The design includes a semiconductor structure with front-side metallization elements and vias extending from the back-side to the front-side metallization. The invention enhances the manufacturing process of semiconductor dies by incorporating barrier layers and back-side metallization.

Career Highlights

William T Pulz is currently employed at Cree GmbH, a company known for its advancements in semiconductor technology. His work at Cree GmbH has allowed him to focus on innovative solutions that address challenges in the semiconductor industry.

Collaborations

Throughout his career, William has collaborated with talented individuals such as Helmut Hagleitner and Fabian Radulescu. These collaborations have contributed to the development of cutting-edge technologies in the semiconductor field.

Conclusion

William T Pulz is a distinguished inventor whose work in semiconductor technology has led to valuable patents and innovations. His contributions continue to shape the future of the industry.