Houston, TX, United States of America

William R Jacobs

This inventor holds 4 USPTO granted patents. Top assignee: Hewlett-Packard Development Company, L.p.. Active years: 2009-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William R Jacobs. Retrieved from https://idiyas.com/inventor/william-r-jacobs

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 75.0

Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2009-2015

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4 patents (USPTO):Explore Patents

Title: William R. Jacobs: Patents in Device Drivers and Thermal Management.

Introduction

William R. Jacobs is an inventor associated with Houston, Texas, and Hewlett-Packard Development Company, L.P. His patent work includes technologies for loading device drivers and verifying heat-sink operation. He is credited with 4 patents.

Latest Patents

“Loading a Device Driver from a Device” describes a device with an interface for connecting to a computer and storage for its device driver. A driver application identifies the connected device as a storage device when its driver is not yet installed, then loads the driver onto the computer.

“Heat Sink Verification” describes a printed circuit board assembly with a processor, a nearby heat sink, and a memory module containing executable logic. The processor runs a load routine and collects temperature-gradient data, which is used to verify that the heat sink is operating.

Career Highlights

Jacobs’s listed inventions address practical computing and hardware concerns: simplifying device-driver installation and using processor temperature data to check heat-sink performance. His work is associated with Hewlett-Packard Development Company, L.P.

Collaborations

Jacobs’s listed coworkers include Phillip A. Leech and Dennis Baker.

Conclusion

William R. Jacobs’s patent portfolio reflects a focus on improving device setup and supporting reliable thermal management in computer hardware.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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