Cicero, NY, United States of America

William R Jackson

This inventor holds 1 USPTO granted patent. Top assignee: The Eraser Company, Inc.. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William R Jackson. Retrieved from https://idiyas.com/inventor/william-r-jackson-19gbg7uq

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of William R. Jackson

Introduction

William R. Jackson is a notable inventor based in Cicero, NY (US). He has made significant contributions to the field of engineering, particularly with his innovative designs in cutting technology. His work has been recognized for its practical applications and efficiency in various industries.

Latest Patents

William R. Jackson holds a patent for a centrifugal cutting apparatus. This invention features a multiple blade centrifugal cutting machine equipped with a planetary gear system. The design ensures that the blades move into the work at the same speed and to an equal depth, allowing for precise severing of work elements or the stripping away of coatings from the core.

Career Highlights

Jackson is currently employed at The Eraser Company, Inc., where he continues to develop and refine cutting technologies. His expertise in mechanical engineering has allowed him to contribute to the advancement of tools used in various manufacturing processes.

Collaborations

Throughout his career, William has collaborated with Igor Korolev, leveraging their combined expertise to enhance the effectiveness of their inventions.

Conclusion

William R. Jackson's innovative work in cutting technology exemplifies the impact of engineering on practical applications. His contributions continue to influence the industry and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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