Hollidaysburg, PA, United States of America

William R Hornung

This inventor holds 1 USPTO granted patent. Top assignee: F. L. Smithe Machine Company, Inc.. Active years: 1992.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William R Hornung. Retrieved from https://idiyas.com/inventor/william-r-hornung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 1992

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1 patent (USPTO):Explore Patents

Title: Biography of William R Hornung

Introduction: William R Hornung is an accomplished inventor based in Hollidaysburg, Pennsylvania. He is known for his innovative contributions to the field of envelope manufacturing technology.

Latest Patents: Hornung holds a patent for a rotary printer designed for an envelope machine. This invention allows for the printing of material on envelope blanks as they are being formed into envelopes. The printer features several components, including an impression cylinder, a plate or type cylinder, an anilox roll, and a fountain roll. The design enables the transfer of ink efficiently while the machine operates.

Career Highlights: Hornung has made significant strides in his career, particularly through his work at F. L. Smithe Machine Company, Inc. His expertise in printing technology has positioned him as a key figure in the development of advanced envelope manufacturing solutions.

Collaborations: Throughout his career, Hornung has collaborated with notable colleagues, including Herbert W Helm and Ilya D Khrakovsky. These partnerships have contributed to the advancement of technology in the envelope production industry.

Conclusion: William R Hornung's innovative spirit and dedication to his craft have led to meaningful advancements in envelope manufacturing technology. His contributions continue to influence the industry and inspire future inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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