William R Bottoms

Title: William R Bottoms: Innovator in Probe Card Technology

Introduction

William R Bottoms is a notable inventor based in Palo Alto, California. He has made significant contributions to the field of semiconductor technology, particularly in the design and fabrication of probe card assemblies. His innovative work has led to the development of a patent that enhances the efficiency and effectiveness of electrical connections in integrated circuits.

Latest Patents

William R Bottoms holds a patent for "Structures and processes for fabrication of probe card assemblies with multi-layer interconnect." This patent focuses on a layout of a semiconductor wafer that comprises multiple integrated circuits located at predefined positions. Each integrated circuit features a set of electrical connection pads. The invention establishes a probe chip contactor with a unit standard cell corresponding to each integrated circuit. This design is repeated to create a wafer-scale standard cell layout. The contact side of the probe chip is connectable to a central structure, such as a Z-block or PC board, which typically includes a fixed array of vias. The routing of the contact side is preferably automated, allowing for efficient electrical connections between the substrate and the central structure.

Career Highlights

William R Bottoms is currently employed at Advantest (Singapore) Pte Ltd, where he continues to work on advancing semiconductor technologies. His expertise in probe card technology has positioned him as a key player in the industry. He has successfully contributed to the development of innovative solutions that improve the performance of semiconductor testing.

Collaborations

Throughout his career, William has collaborated with esteemed colleagues, including Fu Chiung Chong and Erh-Kong Chieh. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

William R Bottoms is a distinguished inventor whose work in probe card technology has made a lasting impact on the semiconductor industry. His patent for multi-layer interconnects exemplifies his commitment to innovation and efficiency in electrical connections. His contributions continue to shape the future of semiconductor technology.