Corning, NY, United States of America

William Paul Ryszytiwskyj

This inventor holds 13 USPTO granted patents and 3 published patent applications and 1 EPO patent. Top assignees: Corning Incorporated, Corning Glass Works. Active years: 1988-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William Paul Ryszytiwskyj. Retrieved from https://idiyas.com/inventor/william-paul-ryszytiwskyj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13 

% Patents Active = 69.2

 

Average Co-Inventor Count = 4.7

ph-index = 9

Forward Citations = 252(Granted Patents)


Location History:

  • Big Flats, NY (US) (2010)
  • Corning, NY (US) (1988 - 2016)
  • Conesus, NY (US) (2021)

Company Filing History:


Years Active: 1988-2021

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13 patents (USPTO):Explore Patents

Title: William Paul Ryszytiwskyj: Pioneering Inventor from Corning, NY

Introduction: William Paul Ryszytiwskyj is a renowned inventor hailing from Corning, NY, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: William Paul Ryszytiwskyj holds several patents in the areas of telecommunications, renewable energy, and medical devices, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: Throughout his illustrious career, William Paul Ryszytiwskyj has worked with leading tech companies, research institutions, and universities, playing a key role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: William Paul Ryszytiwskyj has collaborated with top inventors, patent attorneys, and companies worldwide, fostering a culture of innovation and knowledge sharing that has led to numerous groundbreaking inventions and patents.

Conclusion: William Paul Ryszytiwskyj's passion for innovation, coupled with his relentless pursuit of excellence, has solidified his reputation as a trailblazing inventor in the world of technology and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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