Location History:
- Phoenix, AZ (US) (1977 - 1984)
- Danielson, CT (US) (1985)
- South Killingly, CT (US) (1989)
- Tempe, AZ (US) (1988 - 1994)
Company Filing History:
12 out of 295 
1 out of 832,761 Years Active: 1977-1994
Title: **William P. Harper: Innovator in Multichip Module Technology**
Introduction
William P. Harper, based in Phoenix, AZ, is a prolific inventor with a notable portfolio comprising 13 patents. His innovative contributions primarily focus on advanced technologies for multichip module substrates, enhancing electrical interconnection systems in circuit boards. His work exemplifies the intersection of engineering and creativity, driving forward the capabilities of modern electronic components.
Latest Patents
Among his most recent innovations is a patent for a "Method of Manufacture Multichip Module Substrate." This patent details a manufacturing process utilizing multiple layers of a fluoropolymer composite material and copper, enabling the creation of complex multichip module (MCM) substrates. The process includes a seeding method that fosters reliable bonding between the composite and copper layers, eliminating the need for a barrier metal layer. The design allows for the fabrication of MCM structures with various metal and dielectric layers, facilitating enhanced thermal management through solid copper vias.
Another significant patent revolves around a "Connector Arrangement System and Interconnect Element." This invention introduces an improved electrical interconnection system for circuit boards, featuring elongate, rotatable interconnect elements. These elements engage with contact pads on circuit boards, utilizing a unique configuration where alternating sectors have distinct electrical properties, including conductive and non-conductive characteristics, optimizing performance within electronic assemblies.
Career Highlights
William has significantly contributed to the field while working with Rogers Corporation, a leader in innovative materials and solutions. His career has been marked by a dedication to refining interconnection technology, making him a noteworthy figure in the electronics sector. His inventions continue to influence the design and manufacture of sophisticated electronic devices.
Collaborations
Throughout his career, William P. Harper has collaborated with esteemed colleagues, including Michael S. Lunt and Scott S. Simpson. These collaborations have fostered an environment of creativity and innovation, leading to significant technological advancements in their respective fields.
Conclusion
William P. Harper’s inventive spirit and technical acumen have made substantial contributions to the world of electronics. With a strong foundation in the development of multichip module substrates and advanced interconnection systems, he has paved the way for further innovations that will shape the future of technology. His legacy is marked by a commitment to excellence and a vision that continues to inspire future generations of inventors.