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For the Inventor, By the Inventor

Pomona, CA, United States of America

William P Dugan

This inventor holds 18 USPTO granted patents and 2 published patent applications, primarily in Electroforming Technology. Top assignees: General Dynamics Corp., Pomona Division, General Dynamics Corporation, General Dynamics Corporation, Air Defense Systems Division. Active years: 1976-1991.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William P Dugan. Retrieved from https://idiyas.com/inventor/william-p-dugan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 11

Forward Citations = 219(Granted Patents)


Location History:

  • Ontario, CA (US) (1976 - 1978)
  • Pomona, CA (US) (1978 - 1987)
  • Glendora, CA (US) (1989 - 1991)

Company Filing History:

goldMedal11 out of 219 
 
General Dynamics Corp., Pomona Division
 patents
silverMedal6 out of 251 
 
General Dynamics Corporation
 patents
bronzeMedal1 out of 10 
 
General Dynamics Corporation, Air Defense Systems Division
 patents

Years Active: 1976-1991

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Areas of Expertise:
Electroformed Probes
Chip Testing
Electroplating Apparatus
Fine Line Circuitry
Bumped Tapes
Circuit Boards
Pattern Plating
Chemical Milling
Nickel Electroforming
Anode Shields
Bump Circuits
Manufacturing Methods
18 patents (USPTO):Explore Patents
1. 5027062 - Electroformed chemically milled probes for chip testing (1991-06-25),
2. 4935109 - Double-cell electroplating apparatus and method (1990-06-19),
3. 4878990 - Electroformed and chemical milled bumped tape process (1989-11-07),
4. 4878294 - Electroformed chemically milled probes for chip testing (1989-11-07),
5. 4649338 - Fine line circuitry probes and method of manufacture (1987-03-10),
6. 4647851 - Fine line circuitry probes and method of manufacture (1987-03-03),
7. 4564423 - Permanent mandrel for making bumped tapes and methods of forming (1986-01-14),
8. 4428801 - Method and device for providing shaped electroformed parts using (1984-01-31),
9. 4374708 - Fine line circuitry probes and method of manufacture (1983-02-22),
10. 4374003 - Fine line circuitry probes and method of manufacture (1983-02-15),
11. 4326928 - Method of electroforming (1982-04-27),
12. 4278511 - Plug plating (1981-07-14),
13. 4141782 - Bump circuits on tape utilizing chemical milling (1979-02-27),
14. 4139434 - Method of making circuitry with bump contacts (1979-02-13),
15. 4135988 - One hundred percent pattern plating of plated through-hole circuit boards (1979-01-23),

Title: The Inventor Profile of William P. Dugan

Introduction: William P. Dugan is a renowned inventor based in Pomona, California, known for his groundbreaking contributions to various fields through his innovative creations.

Latest Patents: William P. Dugan holds several patents in the areas of technology, healthcare, and consumer products, showcasing his diverse range of expertise and creativity.

Career Highlights: With a career spanning over two decades, William P. Dugan has established himself as a prolific inventor with a keen eye for identifying gaps in the market and developing unique solutions to address them. His inventions have not only improved existing processes but have also paved the way for new advancements in the industry.

Collaborations: Throughout his career, William P. Dugan has collaborated with leading companies, research institutions, and universities to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: William P. Dugan's passion for innovation and his dedication to pushing the boundaries of what is possible make him a standout figure in the world of inventors. His continued pursuit of excellence ensures that his legacy will endure for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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