Chandler, AZ, United States of America

William P Benjamin


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 55(Granted Patents)


Company Filing History:


Years Active: 1990

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1 patent (USPTO):Explore Patents

Title: William P. Benjamin: Innovator in Thermoplastic Composite Welding

Introduction

William P. Benjamin is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of thermoplastic composite materials, particularly in the area of induction welding technology. His innovative approach has paved the way for advancements in manufacturing processes involving composite materials.

Latest Patents

William P. Benjamin holds a patent for a Thermoplastic Composite Induction Welder. This invention focuses on the induction heating of thermoplastic composite materials to form a continuous bonded joint. The technology utilizes an induction heating coil mounted within a hollow circular roller made of non-conductive material. This setup allows for the creation of a localized heating zone at the joint area of the materials being bonded. The invention also incorporates a method for applying pressure to the joint area, ensuring a strong and effective bond.

Career Highlights

William P. Benjamin is associated with Northrop Corporation, where he has contributed to various projects involving advanced materials and manufacturing techniques. His work has been instrumental in enhancing the efficiency and effectiveness of bonding processes in composite materials.

Collaborations

Throughout his career, William has collaborated with notable colleagues, including Wayne William Schmidt and Robert A. Grimm. These collaborations have further enriched his work and contributed to the development of innovative solutions in the field.

Conclusion

William P. Benjamin's contributions to the field of thermoplastic composite welding demonstrate his commitment to innovation and excellence. His patented technology continues to influence the manufacturing industry, showcasing the importance of advancements in material bonding techniques.

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