Rockleigh, NJ, United States of America

William Miranda

This inventor holds 1 USPTO granted patent. Top assignee: Creston Electronics Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William Miranda. Retrieved from https://idiyas.com/inventor/william-miranda-16rmluf1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: William Miranda and Electronics Enclosure Cooling

Introduction

William Miranda is an inventor associated with Rockleigh, New Jersey, and Creston Electronics Inc. His patent work addresses the challenge of cooling electronic circuitry within an enclosure.

Latest Patents

Miranda’s listed patent, “Apparatus for Cooling Electronic Circuitry,” describes an enclosure designed to guide airflow through separate interior volumes. An air-plenum piece creates an air channel that separates the intake side from the exhaust side, while a fan aligned with an opening in the plenum draws outside air through intake holes and directs it through the enclosure and out through exhaust holes. This arrangement is intended to support airflow across electronic equipment. The supplied information lists 1 patent for Miranda.

Career Highlights

Miranda’s documented invention focuses on practical thermal management for electronics. By organizing airflow within an enclosure, the design offers a structured approach to moving air through equipment rather than allowing intake and exhaust flows to mix freely.

Collaborations

Miranda is associated with Creston Electronics Inc. His listed coworkers include Albert Pedoeem and William Rehak.

Conclusion

William Miranda’s patent reflects an engineering contribution to electronics cooling, using a fan and an internal air channel to manage airflow through an enclosure.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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