Pewaukee, WI, United States of America

William Mentzer

This inventor holds 1 USPTO granted patent. Top assignee: Mgs Mfg. Group, Inc.. Active years: 2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William Mentzer. Retrieved from https://idiyas.com/inventor/william-mentzer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of William Mentzer

Introduction

William Mentzer is a notable inventor based in Pewaukee, Wisconsin. He has made significant contributions to the field of manufacturing through his innovative ideas and patents. His work focuses on improving assembly techniques in injection-molding processes.

Latest Patents

William Mentzer holds a patent for a "Method and system for high volume, in-machine assembly." This invention utilizes revolving mold sections that rotate perpendicularly to the clamping axis of the injection-molding machine. This technique increases usable mold area and provides improved access to molded parts before and after assembly.

Career Highlights

Mentzer is associated with MGS Mfg. Group, Inc., where he applies his expertise in manufacturing and assembly processes. His innovative approach has contributed to the efficiency and effectiveness of production methods in the industry.

Collaborations

William has worked alongside talented individuals such as Brian Hartlmeier and John Joseph Hahn. Their collaboration has fostered a creative environment that encourages innovation and problem-solving.

Conclusion

William Mentzer's contributions to the field of manufacturing through his patent and collaborative efforts highlight his role as an influential inventor. His innovative methods continue to shape the industry and improve production techniques.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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