Company Filing History:
Years Active: 1980-1982
Title: Innovations of William M King
Introduction
William M King is a notable inventor based in Mentor, OH (US). He has made significant contributions to the field of materials science, particularly in the development of metal composites and laminates. With a total of two patents to his name, his work has implications for various industries, including electronics and manufacturing.
Latest Patents
William M King's latest patents focus on metal composites and laminates formed from aluminum alloys. One of his patents describes a metal composite that includes a substrate with a uniformly, mildly etched surface of an aluminum alloy, consisting of at least about 99 wt. % aluminum. The balance comprises specified quantities of silicon, iron, copper, manganese, and zinc, along with a uniformly adhering, electrocathodically deposited copper foil. The resulting peel strength between the aluminum alloy surface and the copper foil, after lamination to a resinous substrate under heat and pressure, ranges from about 6 to about 8 lbs./in. of width of copper foil. This peel strength can be reduced to a value between about 0.3 to about 2 lbs./in. of width by overplating the copper foil with a layer of zinc or indium. The resinous substrate may be a glass fiber reinforced epoxy resin, commonly used in the manufacture of printed circuit boards.
Career Highlights
William M King is associated with Gould Inc., where he has been able to apply his innovative ideas in practical applications. His work has contributed to advancements in the field of metal composites, enhancing the performance and reliability of various products.
Collaborations
William has collaborated with Betty L Berdan, a coworker who shares his passion for innovation and development in materials science.
Conclusion
William M King is a distinguished inventor whose work in metal composites has paved the way for advancements in various industries. His contributions continue to influence the field and inspire future innovations.