The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 1982
Filed:
Aug. 15, 1980
Betty L Berdan, Willowick, OH (US);
William M King, Mentor, OH (US);
Gould Inc., Rolling Meadows, IL (US);
Abstract
A metal composite comprising a substrate having a uniformly, mildly etched surface of an aluminum alloy, e.g. an alloy, consisting of at least about 99 wt. % aluminum, and the balance comprising specified quantities of silicon, iron, copper, manganese and zinc, and a uniformly adhering, electrocathodically deposited copper foil. The resulting peel strength between the aluminum alloy surface and the copper foil, after lamination of the composite to a resinous substrate under heat and pressure is within the range of from about 6 to about 8 lbs./in. of width of copper foil. This can be reduced to a value within the range of about 0.3 to about 2 lbs./in. of width by overplating the copper foil with a layer of zinc or indium. The resinous substrate may be a glass fiber reinforced epoxy resin, such as is used in the manufacture of printed circuit boards.