East Lansing, MI, United States of America

William Lee Clack

This inventor holds 1 USPTO granted patent. Top assignee: Elopak Systems Ag. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William Lee Clack. Retrieved from https://idiyas.com/inventor/william-lee-clack

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of William Lee Clack

Introduction

William Lee Clack is a notable inventor based in East Lansing, MI (US). He has made significant contributions to the field of packaging technology, particularly in the design of apparatuses that enhance the efficiency of attaching fitments to containers. His innovative approach has led to the development of a unique patent that addresses specific challenges in the packaging industry.

Latest Patents

William Lee Clack holds a patent for an "Apparatus for use in and method of attaching cap-form fitments to containers." This invention involves an applicator that affixes fitments, which include a screw cap on a pour spout, to paperboard cartons. The apparatus features an ultrasonic horn that moves between a retracted position for receiving a fitment and an advanced position for depositing the fitment on the outer surface of a carton. The design incorporates a duct that provides fluid communication between an air handler and a fitment-holding recess formed in the horn. The air handler can evacuate the duct to retain a fitment by suction while transporting it to be affixed to the container wall. Additionally, the air handler supplies pressurized gas to blow the fitment from the horn before it returns to the retracted position.

Career Highlights

William Lee Clack is currently employed at Elopak Systems AG, where he continues to innovate in the field of packaging technology. His work has been instrumental in improving the efficiency and effectiveness of packaging processes. With a focus on practical solutions, Clack's inventions have the potential to streamline operations in various manufacturing settings.

Collaborations

Throughout his career, William has collaborated with talented individuals such as Morten Abrahamsen and Michael Dale Clayton. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies in packaging.

Conclusion

William Lee Clack's contributions to the field of packaging technology exemplify the spirit of innovation. His patent for an apparatus that enhances the attachment of fitments to containers showcases his commitment to improving industry standards. As he continues to work at Elopak Systems AG, his future endeavors are likely to yield further advancements in this essential area of manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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