Medford, MA, United States of America

William Kwan

This inventor holds 1 USPTO granted patent. Top assignee: Rogers Corporation. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William Kwan. Retrieved from https://idiyas.com/inventor/william-kwan-rc5l1mlg

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: The Innovations of William Kwan

Introduction

William Kwan is an accomplished inventor based in Medford, MA (US). He has made significant contributions to the field of sensor technology. His innovative work has led to the development of a unique layered sensor apparatus.

Latest Patents

Kwan holds a patent for a "Layered sensor apparatus and method of making same." This sensor apparatus consists of multiple layers, including a top layer, a bottom layer, and at least one intermediate layer that contains an electrical conductor layer. Each layer is in direct contact with its adjacent layer. The design allows the apparatus to generate a piezoelectric voltage without the need for an external current-producing device when deformed. Additionally, it produces a change in capacitance in response to deformation.

Career Highlights

William Kwan is currently employed at Rogers Corporation, where he continues to innovate in the field of sensor technology. His work has garnered attention for its potential applications in various industries.

Collaborations

Kwan collaborates with talented individuals such as Karl Edward Sprentall and Trevor Polidore. Their combined expertise contributes to the advancement of technology at Rogers Corporation.

Conclusion

William Kwan's contributions to sensor technology exemplify the spirit of innovation. His patent for the layered sensor apparatus showcases his ability to create impactful solutions in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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