Aurora, OH, United States of America

William Korecky

This inventor holds 1 USPTO granted patent. Top assignee: The Hc Companies, Inc.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William Korecky. Retrieved from https://idiyas.com/inventor/william-korecky

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: The Innovative Journey of William Korecky

Introduction

William Korecky is an accomplished inventor based in Aurora, OH (US). He has made significant contributions to the field of packaging technology. With a focus on innovation, he has developed a unique packaging device that showcases his creativity and technical expertise.

Latest Patents

William holds one patent for his innovative packaging device. This invention reflects his commitment to improving packaging solutions and enhancing user experience. His work in this area has the potential to impact various industries that rely on effective packaging.

Career Highlights

William is currently employed at The Hc Companies, Inc., where he applies his skills and knowledge to develop new products. His role at the company allows him to collaborate with other talented professionals and contribute to the advancement of packaging technology.

Collaborations

Some of William's coworkers include Jessica Benoit and Darren May. Their teamwork fosters a creative environment that encourages innovation and the sharing of ideas.

Conclusion

William Korecky is a dedicated inventor whose work in packaging technology exemplifies his innovative spirit. His contributions to the field are noteworthy, and his patent reflects his ability to create practical solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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