Bath, NY, United States of America

William J Von Hagn

This inventor holds 1 USPTO granted patent. Top assignee: Corning Incorporated. Active years: 1995.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William J Von Hagn. Retrieved from https://idiyas.com/inventor/william-j-von-hagn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 1995

Loading Chart...
1 patent (USPTO):Explore Patents

Title: William J Von Hagn: Innovator in Heat Exchange Technology

Introduction

William J Von Hagn is a notable inventor based in Bath, NY (US). He has made significant contributions to the field of heat exchange technology. His innovative approach has led to the development of a unique patent that enhances the efficiency of heat exchangers.

Latest Patents

William J Von Hagn holds a patent for "Coated alternating-flow heat exchanges and method of making." This invention involves an alternating-flow heat exchanger that features a substrate with open-ended, straight passageways. The design includes at least one end cap that diverts flow into primary and secondary flow paths. The ceramic substrate is coated with a desirable coating, and the end cap is applied to direct flow from the passages effectively.

Career Highlights

William is currently employed at Corning Incorporated, where he continues to innovate and develop new technologies. His work at Corning has allowed him to collaborate with other talented professionals in the field.

Collaborations

One of his notable coworkers is G Daniel Lipp, with whom he has likely shared insights and expertise in their projects.

Conclusion

William J Von Hagn's contributions to heat exchange technology exemplify the spirit of innovation. His patent reflects a commitment to improving efficiency in thermal management systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…