Amherst, OH, United States of America

William J Bishop

This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Brush Wellman, Inc.. Active years: 2002-2003.


% Patents Active = 100.0


Average Co-Inventor Count = 2.7

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2002-2003

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2 patents (USPTO):Explore Patents

Title: The Innovations of William J Bishop

Introduction

William J Bishop is a notable inventor based in Amherst, OH (US). He has made significant contributions to the field of electroplating and materials science, holding 2 patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is focused on the manufacture of fine-grained electroplating anodes. This invention involves a continuously cast copper ingot produced through a process that imparts turbulence to the metal/solid interface during casting. The resulting ingot is then hot worked to create a billet with a smaller average grain size and a larger diameter than previously achievable. This billet is particularly valuable for producing electroplating anodes used in the damascene process for creating copper interconnects in silicon wafers. Another significant patent addresses the rapid quench of large sections of solution annealed, precipitation hardenable alloys. This method allows for the production of large sections that are resistant to internal cracking while remaining fully hardenable. The process involves stabilizing the temperature of the section immediately above the alloy's solvus temperature during rapid quenching, ensuring optimal material properties.

Career Highlights

Throughout his career, William J Bishop has worked with prominent companies such as Brush Wellman, Inc. and Materion Brush Inc. His experience in these organizations has contributed to his development as an inventor and has allowed him to apply his innovative ideas in practical settings.

Collaborations

William has collaborated with notable coworkers, including Noel M Brady and Walter R Cribb. These partnerships have likely enriched his work and contributed to the success of his inventions.

Conclusion

William J Bishop's contributions to the field of electroplating and materials science are noteworthy. His innovative patents and career achievements reflect his dedication to advancing technology and improving manufacturing processes.

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