Pittsburgh, PA, United States of America

William H Rackoff

This inventor holds 1 USPTO granted patent. Top assignee: Asko, Inc.. Active years: 1996.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William H Rackoff. Retrieved from https://idiyas.com/inventor/william-h-rackoff

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1996

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1 patent (USPTO):Explore Patents

Title: The Innovations of William H. Rackoff

Introduction

William H. Rackoff is an accomplished inventor based in Pittsburgh, PA. He is known for his innovative contributions to the field of computer design tools, particularly in the area of rotary slitting of metal. His work has significantly impacted manufacturing processes, enhancing efficiency and precision.

Latest Patents

William H. Rackoff holds a patent for a "Computer design tool for rotary slitting of metal and a method of use." This invention provides a predictive indication of slit width variation, allowing for adjustments in arbor setup during the rotary slitting process. The design tool analyzes historical slitting runs to deliver accurate predictions, thereby improving operational outcomes.

Career Highlights

Rackoff is currently employed at Asko, Inc., where he continues to develop innovative solutions in the manufacturing sector. His expertise in computer design tools has positioned him as a valuable asset to his company and the industry at large.

Collaborations

One of his notable coworkers is Albert R. Zelt, III, with whom he has likely collaborated on various projects within the company.

Conclusion

William H. Rackoff's contributions to the field of computer design tools exemplify the spirit of innovation. His patent and ongoing work at Asko, Inc. highlight his commitment to advancing technology in manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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