Vestal, NY, United States of America

William F Williams

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1981.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William F Williams. Retrieved from https://idiyas.com/inventor/william-f-williams-01va2hpg

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 1981

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1 patent (USPTO):Explore Patents

Title: The Innovations of William F. Williams

Introduction

William F. Williams is a notable inventor based in Vestal, NY (US). He has made significant contributions to the field of solder mask compositions, particularly with his innovative patent that enhances the manufacturing process in electronics.

Latest Patents

William holds a patent for a "Screenable and Strippable Solder Mask and Use Thereof." This invention features a composition that includes a polyepoxide or polyimide/amide, a detackifier, and a high-temperature resistant filler. The primary purpose of this solder mask is to protect predetermined areas on a substrate from solder deposition, thereby improving the efficiency and quality of electronic manufacturing.

Career Highlights

William F. Williams is associated with the International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to be at the forefront of technological advancements in the electronics industry. His innovative approach and dedication to research have made him a valuable asset to his team.

Collaborations

Throughout his career, William has collaborated with talented individuals such as Peter Bakos and Russell E. Darrow. These partnerships have fostered an environment of creativity and innovation, leading to advancements in their respective fields.

Conclusion

William F. Williams exemplifies the spirit of innovation through his contributions to solder mask technology. His patent and work at IBM highlight his commitment to enhancing electronic manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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