Richmond, VT, United States of America

William F Smith

This inventor holds 3 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2002-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William F Smith. Retrieved from https://idiyas.com/inventor/william-f-smith-aar03a9w

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 33.3

Average Co-Inventor Count = 5.1

ph-index = 3

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 2002-2006

Loading Chart...
3 patents (USPTO):Explore Patents

Title: The Innovations of William F. Smith

Introduction

William F. Smith is a notable inventor based in Richmond, Vermont. He has made significant contributions to the field of integrated circuit design, holding a total of 3 patents. His work has been instrumental in advancing technologies that enhance the functionality and efficiency of electronic devices.

Latest Patents

One of his latest patents is the "Multiple Supply Gate Array Backfill Structure." This invention describes a multiple supply gate array structure that is facilitated by the provision of a shared n-well and an isolated n-well. The gate array structure allows for the implementation of either a single voltage circuit or a multiple voltage circuit. Additionally, it enables metal reprogramming to provide standard logic functions or special logic functions, such as a buffer function for signals crossing a voltage island boundary. Other special logic functions may include a level-shifter function or a fence-hold function.

Another significant patent is the "Power Switch Circuit Sizing Technique." This integrated circuit structure features at least one voltage island and a pattern of power switches within that island. The pattern determines the number of power switches and spaces them evenly according to the size of the serviceable area to which each power switch can provide power. The size of the power switches is matched to the current and voltage provided by the power buses, ensuring optimal performance.

Career Highlights

William F. Smith is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and contribute to the field of technology. His work at IBM has allowed him to collaborate with some of the brightest minds in the industry.

Collaborations

Some of his notable coworkers include John Maxwell Cohn and Paul Steven Zuchowski. Their collaborative efforts have further enhanced the innovative projects they have undertaken together.

Conclusion

William F. Smith's contributions to integrated circuit design and his innovative patents have made a lasting impact on the technology industry. His work continues to influence the development of advanced electronic systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…