This inventor holds 1 USPTO granted patent. Top assignee: Sandia Corporation. Active years: 2002.
Company Filing History:
Years Active: 2002
Title: William F. Filter: Innovator in Micromechanical Die Attachment
Introduction
William F. Filter is a notable inventor based in Albuquerque, NM (US). He has made significant contributions to the field of micromechanical systems, particularly through his innovative patent related to die attachment structures. His work is essential for advancing technologies in semiconductor manufacturing and microelectromechanical systems.
Latest Patents
William F. Filter holds a patent for a "Micromechanical die attachment surcharge." This invention discloses an attachment structure designed for securely attaching a die to a supporting substrate without the use of adhesives or solder. The structure utilizes a plurality of shaped pillars, which can be formed through micromachining. These pillars create a friction bond by engaging with various mating structures, ensuring a reliable connection. The attachment structure is particularly beneficial for mounting fragile semiconductor die containing microelectromechanical (MEM) devices, microsensors, or integrated circuits (ICs). It also facilitates the formation of multichip modules, enhancing the durability and performance of these delicate components.
Career Highlights
William F. Filter is associated with Sandia Corporation, where he applies his expertise in micromechanical systems. His innovative approach to die attachment has positioned him as a key figure in the development of advanced semiconductor technologies. His work not only contributes to the efficiency of manufacturing processes but also ensures the integrity of sensitive devices during assembly.
Collaborations
William has collaborated with John P. Hohimer, further enhancing the impact of his innovations in the field. Their combined efforts have led to advancements in micromechanical systems and semiconductor technologies.
Conclusion
William F. Filter's contributions to micromechanical die attachment technology represent a significant advancement in the field of semiconductor manufacturing. His innovative solutions continue to influence the development of reliable and efficient electronic devices.