De Pere, WI, United States of America

William F Donart

This inventor holds 1 USPTO granted patent. Top assignee: Green Bay Packaging, Inc.. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William F Donart. Retrieved from https://idiyas.com/inventor/william-f-donart

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of William F. Donart

Introduction

William F. Donart is a notable inventor based in DePere, Wisconsin. He has made significant contributions to the field of packaging technology. His innovative approach has led to the development of a unique device that enhances the efficiency of packaging operations.

Latest Patents

William F. Donart holds a patent for a device designed for compressing a folded edge. This device is specifically used to uniformly compress a folded edge of a workpiece, such as a box blank. The invention allows the blank to be utilized more easily in subsequent packaging operations. The device features a pressure roller mounted to a rotatable adjustment member, with the rotational axis of the pressure roller offset from that of the adjustment member. This design enables precise engagement with the folded edge of a workpiece.

Career Highlights

Donart is associated with Green Bay Packaging, Inc., where he applies his expertise in packaging technology. His work has contributed to advancements in the efficiency and effectiveness of packaging processes.

Collaborations

Some of his notable coworkers include Jeffrey M. Stieber and Kenneth A. Stein, who have collaborated with him on various projects within the company.

Conclusion

William F. Donart's innovative device for compressing folded edges exemplifies his commitment to improving packaging technology. His contributions continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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