Williamstown, PA, United States of America

William E Bond


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of William E. Bond

Introduction

William E. Bond is a notable inventor based in Williamstown, PA (US). He has made significant contributions to the field of textile innovation, particularly with his patented invention that enhances the functionality of fabrics.

Latest Patents

William E. Bond holds a patent for the Eco Loop Closure Fabric. This innovative knitted textile fabric features a first knitted fabric layer that includes a first set of yarns. The first layer is designed with outwardly extending pile underlap loops on one face, which are adapted for mated engagement with the hooking elements of a hook component in a hook-and-loop fastener. Additionally, the fabric includes a second knitted layer that has a second set of yarns attached to the first layer. This second set of yarns consists of a plurality of filaments, where adjacent filaments and yarns are fused together, enhancing the fabric's durability and functionality.

Career Highlights

William E. Bond is currently associated with Lear Corporation, a company known for its expertise in automotive seating and electrical systems. His work at Lear Corporation has allowed him to apply his innovative ideas in practical applications, contributing to advancements in textile technology.

Collaborations

Throughout his career, William has collaborated with talented individuals such as David L. Burke and Peter Nittmann. These collaborations have fostered a creative environment that encourages the development of groundbreaking ideas and solutions.

Conclusion

William E. Bond's contributions to textile innovation, particularly through his Eco Loop Closure Fabric patent, exemplify his commitment to advancing technology in the industry. His work at Lear Corporation and collaborations with other professionals further highlight his impact on the field.

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