Deer Park, OH, United States of America

William E Berry

This inventor holds 1 USPTO granted patent. Top assignee: Cincinnati Milacron Inc.. Active years: 1987.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William E Berry. Retrieved from https://idiyas.com/inventor/william-e-berry-xgy2az3x

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 1987

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1 patent (USPTO):Explore Patents

Title: The Innovations of William E. Berry

Introduction

William E. Berry is a notable inventor based in Deer Park, OH (US). He has made significant contributions to the field of industrial robotics. With a focus on innovation, Berry has developed technologies that enhance automation in manufacturing processes.

Latest Patents

William E. Berry holds a patent for an industrial robot. This invention showcases his expertise in robotics and automation, reflecting the growing demand for efficient manufacturing solutions. His patent is a testament to his innovative spirit and technical skills.

Career Highlights

Berry is associated with Cincinnati Milacron Inc., a company known for its advancements in manufacturing technology. His work at this organization has allowed him to contribute to various projects that push the boundaries of industrial automation.

Collaborations

Throughout his career, William E. Berry has collaborated with notable colleagues, including Theodore H. Stackhouse and Edward J. Bailey. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

William E. Berry's contributions to industrial robotics exemplify the impact of innovation in manufacturing. His patent and collaborations highlight his commitment to advancing technology in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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