Frisco, TX, United States of America

William David Boyd


Average Co-Inventor Count = 2.8

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Plano, TX (US) (2006)
  • Frisco, TX (US) (2009 - 2011)

Company Filing History:


Years Active: 2006-2011

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4 patents (USPTO):Explore Patents

Title: Innovator Spotlight: William David Boyd

Introduction: William David Boyd is an accomplished inventor based in Frisco, Texas, known for his significant contributions to the field of semiconductor technology. With a portfolio of four patents to his name, Boyd has carved out a niche in improving the efficiency and performance of electronic devices through innovative packaging solutions.

Latest Patents: One of Boyd's latest patents is for a "Thermally Enhanced Single Inline Package (SIP)." This innovation details a method and system for fabricating a thermally enhanced semiconductor device, packaged as a through-hole SIP. The design incorporates a unique leadframe featuring a die pad for attaching an integrated circuit (IC) die. This configuration includes a first plurality of conductive leads formed from a metal sheet and a second portion of metal sheet located on the opposite side of the IC die. Boyd’s innovation allows for efficient heat dissipation through a heat spreader that manages the heat generated by the IC die, ensuring improved thermal management for semiconductor devices.

Career Highlights: Boyd is currently associated with Texas Instruments Corporation, a leader in semiconductor design and manufacturing. His work emphasizes the development of advanced packaging solutions that enhance device reliability and performance. Throughout his career, he has been instrumental in pushing the boundaries of semiconductor technology.

Collaborations: Throughout his career, Boyd has collaborated with other experts in the field, including notable coworkers Anthony Louis Coyle and Chris Edward Haga. Their collective efforts contribute to the innovative advancements made at Texas Instruments Corporation.

Conclusion: William David Boyd exemplifies the spirit of innovation in the semiconductor industry. With his recent patents that focus on thermally enhanced packaging, he plays a crucial role in advancing technology that underpins modern electronic devices. His ongoing contributions inspire engineers and inventors alike in the pursuit of technological excellence.

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