The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2011
Filed:
Sep. 24, 2009
Chris E Haga, McKinney, TX (US);
Anthony L Coyle, Plano, TX (US);
William D Boyd, Frisco, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
In a method and system for fabricating a thermally enhanced semiconductor device () is packaged as a through hole single inline package (SIP). A leadframe () having a die pad () to attach an IC die (), a first plurality of conductive leads () formed from a first portion of metal sheet (), and a second portion of metal sheet () disposed on an opposite side of the IC die () as the first plurality of conductive leads is stamped from a metal sheet. The first plurality of conductive leads () are arranged in a single line and are capable of being through hole mounted in accordance with the SIP. The second portion of metal sheet () includes the die pad () to form a heat spreader () in the form of the metal sheet. The heat spreader () provides heat dissipating for the heat generated by the IC die ().