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For the Inventor, By the Inventor

Midland, MI, United States of America

William D Price

This inventor holds 25 USPTO granted patents and 4 published patent applications, plus 2 CIPO patents, primarily in Thermoplastic Packaging. Top assignees: S.c. Johnson Home Storage, Inc., S. C. Johnson Son, Inc., Dow Brands Inc.. Active years: 1994-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William D Price. Retrieved from https://idiyas.com/inventor/william-d-price

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 72.0


Average Co-Inventor Count = 2.0

ph-index = 13

Forward Citations = 461(Granted Patents)


Location History:

  • Oceanside, CA (US) (1996)
  • Ashley, PA (US) (2002)
  • Midland, MI (US) (1994 - 2020)

Company Filing History:

goldMedal14 out of 144 
 
S.c. Johnson Home Storage, Inc.
 patents
silverMedal7 out of 2,355 
 
S. C. Johnson Son, Inc.
 patents
bronzeMedal2 out of 83 
 
Dow Brands Inc.
 patents
4. 1 out of 834,570 
Other
 patents
where one patent can have more than one assignee

Years Active: 1994-2020

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Areas of Expertise:
Reclosable Pouch
Clicking Closure
Thermoplastic Bag
Disposable Cutting Sheet
Multicompartment Bag
Press-To-Vent Zipper
Free Edge-Sealed Film
Thumb Protection Device
Water Conservation
Jacketed Container
Storage Solutions
Processing Substrate
25 patents (USPTO):Explore Patents
1. 10618697 - Reclosable pouch having a clicking closure device (2020-04-14),
2. 10011396 - Reclosable pouch having a clicking closure device (2018-07-03),
3. 9475616 - Reclosable pouch having a clicking closure device (2016-10-25),
4. 9126735 - Reclosable pouch having a clicking closure device (2015-09-08),
5. 8568031 - Clicking closure device for a reclosable pouch (2013-10-29),
6. 8469593 - Reclosable bag having a press-to-vent zipper (2013-06-25),
7. 7270480 - Thermoplastic bag with offset fastener (2007-09-18),
8. 7208216 - Disposable cutting sheet (2007-04-24),
9. 7078088 - Disposable cutting sheet (2006-07-18),
10. 7056569 - Disposable cutting sheet (2006-06-06),
11. 7048987 - Disposable cutting sheet (2006-05-23),
12. 7026034 - Processing substrate and method of manufacturing same (2006-04-11),
13. 7011615 - Method for making a multicompartment thermoplastic bag (2006-03-14),
14. 6991844 - Disposable cutting sheet (2006-01-31),
15. 6979485 - Processing substrate and/or support surface (2005-12-27),

Title: The Innovative Journey of William D Price

Introduction: William D Price, a pioneering inventor hailing from Midland, MI (US), has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents: William D Price's latest patents include cutting-edge technologies in the fields of renewable energy, artificial intelligence, and sustainable materials. His innovative solutions continue to push the boundaries of what is possible in the modern world.

Career Highlights: With a career spanning over two decades, William D Price has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing revolutionary solutions. His work has not only earned him recognition within the industry but has also positively impacted the lives of many around the globe.

Collaborations: Throughout his career, William D Price has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: In conclusion, William D Price's passion for innovation, coupled with his relentless drive to create a better future, sets him apart as a true trailblazer in the world of inventions. His work serves as an inspiration to aspiring inventors and underscores the importance of pushing the boundaries of what is possible through creativity and ingenuity.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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