Amelia, OH, United States of America

William D Herdtner

This inventor holds 1 USPTO granted patent. Top assignee: Cincinnati Milacron Inc.. Active years: 1991.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William D Herdtner. Retrieved from https://idiyas.com/inventor/william-d-herdtner

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 1991

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of William D. Herdtner

Introduction

William D. Herdtner is a notable inventor based in Amelia, Ohio. He has made significant contributions to the field of molding technology, particularly with his innovative mold clamping system. His work has been instrumental in enhancing the efficiency and effectiveness of molding processes.

Latest Patents

Herdtner holds a patent for a mold clamping system designed for molding articles by injecting a flowable material into a mold cavity defined by a pair of movable mold sections. This system features a hydraulically operated mold clamping mechanism and a separate hydraulic fluid reservoir. The design allows for a reduction in the overall height of the molding machine, making it more compact and efficient. The clamping system includes a level sensor and a comparator to monitor the fluid level, ensuring optimal operation during high-pressure injection.

Career Highlights

William D. Herdtner is associated with Cincinnati Milacron Inc., where he has applied his expertise in molding technology. His innovative designs have contributed to advancements in the manufacturing sector, particularly in the production of molded articles.

Collaborations

Herdtner has worked alongside Frederick F. Van Keuren, collaborating on various projects that have furthered their shared goals in the field of molding technology.

Conclusion

William D. Herdtner's contributions to the field of molding technology through his innovative mold clamping system exemplify the impact of dedicated inventors in advancing industrial processes. His work continues to influence the efficiency of molding operations today.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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