Location History:
- Concord, OH (US) (1994)
- Chardon, OH (US) (1998 - 2023)
Company Filing History:
Years Active: 1994-2023
Title: The Innovative Contributions of William D Cooper
Introduction
William D Cooper is a notable inventor based in Chardon, OH (US). He has made significant contributions to the field of packaging technology, particularly in the area of wire storage solutions. With a total of 11 patents to his name, Cooper's work reflects a commitment to innovation and practicality.
Latest Patents
One of Cooper's latest patents is a method and apparatus for packaging wire in a storage container. This invention features a container that includes an outer box and a polygonal liner located within the outer box. The polygonal liner is designed with a plurality of vertical walls, allowing a continuous length of wire to be stored in a structured manner. The wire forms multiple layers, with each layer consisting of a series of wire loops arranged polygonally along the vertical walls of the liner. This design enhances the efficiency of wire storage and accessibility.
Career Highlights
Throughout his career, William D Cooper has worked with prominent companies such as Lincoln Global, Inc. and The Lincoln Electric Company. His experience in these organizations has contributed to his expertise in developing innovative packaging solutions.
Collaborations
Cooper has collaborated with notable individuals in his field, including Randal P Stuart and Richard Andzel. These partnerships have likely fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
William D Cooper's contributions to the field of wire packaging demonstrate his innovative spirit and dedication to improving storage solutions. His patents and collaborations reflect a career marked by significant achievements and a commitment to advancing technology.