This inventor holds 1 USPTO granted patent. Top assignee: Semiconductor Components Industries, LLC. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: The Innovations of William Crofoot
Introduction
William Crofoot is an accomplished inventor based in Nampa, Idaho. He has made significant contributions to the field of image sensor technology. His innovative work has led to the development of a unique patent that enhances the functionality of image sensors.
Latest Patents
William Crofoot holds a patent for an "Image sensor with a bond pad." This invention includes a sensor chip that is bonded to an application-specific integrated circuit (ASIC) chip. A bond pad for the image sensor is formed in the ASIC chip and is exposed through a trench in the sensor chip. The design incorporates a conductive light shield at the periphery of the image sensor to shield optically black pixels. Additionally, an opaque layer is formed over the conductive light shield to mitigate reflections. An anti-reflective layer is also included, which has a different thickness over the pixel array than in the trench for the bond pad. This innovative design improves the overall performance of image sensors.
Career Highlights
William Crofoot is currently employed at Semiconductor Components Industries, LLC. His work at this company has allowed him to focus on advancing semiconductor technology. His patent reflects his expertise and dedication to innovation in the field.
Collaborations
William has collaborated with notable coworkers, including Marc Allen Sulfridge and Swarnal Borthakur. Their combined efforts contribute to the advancement of technology in their respective fields.
Conclusion
William Crofoot's contributions to image sensor technology exemplify the spirit of innovation. His patent showcases his ability to solve complex problems in the semiconductor industry. His work continues to influence advancements in image sensor design and functionality.