This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: The Boeing Company. Active years: 1986.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1986
Title: William C. Wilkinson: Innovator in Thermal Conductivity
Introduction
William C. Wilkinson is an accomplished inventor based in Redmond, WA (US). He is known for his significant contributions to the field of printed wiring board technology. His innovative work focuses on enhancing thermal conductivity in electronic devices.
Latest Patents
William C. Wilkinson holds a patent for a thermally conductive printed wiring board laminate. This laminate is particularly suitable for use with leadless surface-mounted devices, such as ceramic chip carriers. The invention combines a low coefficient of thermal expansion in the X-Y direction with thermal conductivity. In one embodiment, the laminate comprises a support fabricated from graphite fiber reinforced metal, which is adhesively secured to a printed wiring board made from dielectric (e.g., glass) fiber reinforced resin. The support has an X-Y coefficient of thermal expansion less than about 4 ppm/°C, while the printed wiring board has a coefficient of thermal expansion greater than about 10 ppm/°C. In a second embodiment, the support consists of a core of graphite fiber reinforced metal or resin sandwiched between two metal sheets. This innovative design enhances the performance and reliability of electronic devices.
Career Highlights
William C. Wilkinson is associated with The Boeing Company, where he applies his expertise in materials science and engineering. His work has contributed to advancements in aerospace technology, particularly in the development of electronic systems that require efficient thermal management.
Collaborations
William has collaborated with notable professionals in his field, including his coworker Warren M. Jensen. Their combined efforts have led to significant advancements in the technology surrounding printed wiring boards.
Conclusion
William C. Wilkinson's innovative contributions to thermal conductivity in printed wiring boards demonstrate his commitment to advancing technology in the aerospace industry. His patent reflects a deep understanding of materials and their applications in modern electronics.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile