Milford, MA, United States of America

William C Lindsey

This inventor holds 1 USPTO granted patent. Top assignee: International Shoe Machine Corporation. Active years: 1980.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William C Lindsey. Retrieved from https://idiyas.com/inventor/william-c-lindsey-mn2gt31v

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 1980

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of William C. Lindsey

Introduction

William C. Lindsey is a notable inventor based in Milford, MA, who has made significant contributions to the field of shoe manufacturing. With a focus on improving the methods used in the industry, Lindsey has developed a unique patent that enhances the production process.

Latest Patents

Lindsey holds a patent for a "Method of stretching an upper about the vamp of a last." This innovative method allows for the stretching of an upper mounted on a last while the last is supported bottom-down. The process involves gripping the upper margin with toe and ball pincers, which are then moved to cause the upper to buckle into the throat of the last, effectively stretching the upper about the vamp.

Career Highlights

Throughout his career, Lindsey has been associated with the International Shoe Machine Corporation, where he has applied his expertise to develop practical solutions for the shoe manufacturing industry. His work has contributed to advancements in production techniques, making the process more efficient and effective.

Conclusion

William C. Lindsey's innovative methods and dedication to improving shoe manufacturing processes highlight his importance as an inventor in the industry. His patent reflects a commitment to enhancing production techniques, which benefits both manufacturers and consumers alike.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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