Meridian, ID, United States of America

William B Weiser


Average Co-Inventor Count = 1.7

ph-index = 4

Forward Citations = 82(Granted Patents)


Location History:

  • Meridian, ID (US) (2012 - 2018)
  • Nampa, ID (US) (2021)

Company Filing History:


Years Active: 2012-2021

Loading Chart...
12 patents (USPTO):

Title: The Innovative Contributions of William B. Weiser

Introduction

William B. Weiser is a notable inventor based in Meridian, ID (US), recognized for his significant contributions to the field of semiconductor packaging and wireless module architecture. With a total of 12 patents to his name, Weiser has made a lasting impact on technology through his innovative designs and methods.

Latest Patents

Among his latest patents is the "Polygonal BGA Semiconductor Package." This invention features a ball grid array (BGA) package for integrated circuit devices, which includes a substrate material that encloses the integrated circuit and is shaped into a polygon with at least five sides. The design allows for an array of contacts that are electrically coupled to the terminals of the integrated circuit, enhancing the efficiency of the package.

Another significant patent is the "Method of Manufacturing an On-Board Wireless Module Architecture." This method outlines the process of forming a wireless module on a circuit board, along with a host controller module. It includes the creation of perforations that separate different regions of the circuit board and ensures that trace structures are electrically coupled, facilitating seamless communication between components.

Career Highlights

William B. Weiser has worked with prominent companies such as Marvell International Limited and Marvell World Trade Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the semiconductor and wireless communication sectors.

Collaborations

Throughout his career, Weiser has collaborated with talented individuals, including Mark David Montierth and Lyman Leonard Hall. These partnerships have fostered an environment of innovation and creativity, leading to the development of advanced technologies.

Conclusion

William B. Weiser's contributions to the fields of semiconductor packaging and wireless technology are noteworthy. His innovative patents and collaborations reflect his dedication to advancing technology and improving electronic devices.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…