This inventor holds 1 USPTO granted patent. Top assignee: Hewlett-Packard Company. Active years: 1994.
Company Filing History:
Years Active: 1994
Title: William B Reid - Innovator in Electrostatic Discharge Protection
Introduction
William B Reid is a notable inventor based in Solana Beach, California. He has made significant contributions to the field of electrostatic discharge (ESD) protection, particularly in the design of interconnect circuits. His innovative work has led to the development of a patent that addresses critical issues in electronic device protection.
Latest Patents
William B Reid holds a patent for "Ground ring/spark gap ESD protection of tab circuits." This patent describes an electrostatic discharge protection structure formed on an interconnect circuit. The structure includes elongated interconnect lines and contact pads formed on a dielectric substrate. The design ensures that portions of the interconnect circuit are protected from physical contact by individuals. The electrostatic discharge protection structure features an interconnected conductive grounding metallization ground pattern, which includes a ground ring pattern adjacent to selected edges of the substrate. Additionally, it incorporates conductive metallization traces and spark gaps formed between the interconnect pads and the conductive grounding pattern.
Career Highlights
William B Reid is associated with Hewlett-Packard Company, where he has contributed to various projects and innovations. His work in ESD protection has been instrumental in enhancing the reliability and durability of electronic devices.
Collaborations
One of his notable coworkers is Jon J Fong, with whom he has collaborated on various projects within the company.
Conclusion
William B Reid's contributions to electrostatic discharge protection have made a significant impact in the field of electronics. His innovative patent demonstrates his commitment to improving device safety and reliability.