Wayzata, MN, United States of America

William Arthur Buckner

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Cargill Inc.. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William Arthur Buckner. Retrieved from https://idiyas.com/inventor/william-arthur-buckner

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: The Innovations of William Arthur Buckner

Introduction

William Arthur Buckner is a notable inventor based in Wayzata, Minnesota. He has made significant contributions to the field of food packaging through his innovative ideas. His work has led to the development of a unique food product package system, which has garnered attention in the industry.

Latest Patents

William holds 1 patent for his food product package system. This invention showcases his ability to create practical solutions that enhance the way food products are packaged and preserved.

Career Highlights

William is currently employed at Cargill Inc., a leading global food corporation. His role at Cargill allows him to apply his inventive skills in a dynamic environment, contributing to the company's mission of nourishing the world.

Collaborations

William has collaborated with his coworker, Curtis J Cundith, to further enhance their projects and innovations. Their teamwork exemplifies the importance of collaboration in the field of invention.

Conclusion

William Arthur Buckner's contributions to food packaging innovation reflect his dedication to improving industry standards. His work at Cargill Inc. and his patent demonstrate his commitment to advancing food product safety and efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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