Bloomington, MN, United States of America

William A Nelson

This inventor holds 1 USPTO granted patent. Top assignee: Seagate Technology Incorporated. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William A Nelson. Retrieved from https://idiyas.com/inventor/william-a-nelson-6hgx255p

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2014

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations of William A. Nelson

Introduction

William A. Nelson is an accomplished inventor based in Bloomington, MN (US). He has made significant contributions to the field of technology, particularly in the area of solder ball pattern forming. His innovative work has led to the development of a unique apparatus that enhances the efficiency of ball grid array presentment.

Latest Patents

William A. Nelson holds a patent for a ball grid array presentment apparatus and associated method. This apparatus features a stationary guard that defines a first passage. A core is mounted adjacent to the stationary guard, which is operably moveable between an unload position and a second position. The core defines a second passage and supports a workpiece fixture that operably retains the ball grid array. In the unload position, the core aligns the second passage with the first passage, allowing for the unloading of the ball grid array. Conversely, in the second position, the core misaligns the second passage from the first passage, creating an enclosure around the workpiece fixture that contains a supply of balls not retained in the ball grid array.

Career Highlights

William A. Nelson is currently employed at Seagate Technology Incorporated, where he continues to innovate and contribute to advancements in technology. His work has been instrumental in improving manufacturing processes and enhancing product reliability.

Collaborations

Throughout his career, William has collaborated with notable colleagues, including Niandong Liu and James O. Anderson. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

William A. Nelson's contributions to the field of technology, particularly through his patent on solder ball pattern forming, exemplify his innovative spirit and dedication to advancing manufacturing processes. His work at Seagate Technology Incorporated and collaborations with esteemed colleagues further highlight his impact in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…