Malden Bridge, NY, United States of America

William A Lanford


Average Co-Inventor Count = 2.3

ph-index = 4

Forward Citations = 77(Granted Patents)


Company Filing History:


Years Active: 1997-2000

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5 patents (USPTO):Explore Patents

Title: The Innovative Work of William A Lanford: Pioneering Copper Conductive Layers in Microelectronic Applications

Introduction: William A Lanford, a prolific inventor hailing from Malden Bridge, NY, has made significant contributions to the field of microelectronics with his groundbreaking patented technologies.

Latest Patents: Lanford's latest patents showcase his expertise in passivated copper conductive layers for microelectronic applications and oxidation-resistant high-conductivity copper layers. These technologies mark advancements in the realm of copper conductor formation and oxidation resistance in microelectronic devices.

Career Highlights: With a total of 5 patents to his name, Lanford has demonstrated a keen understanding of material science and engineering principles. His work focuses on enhancing the performance and reliability of copper layers in microelectronic applications, paving the way for more efficient and durable electronic devices.

Collaborations: Throughout his career, Lanford has collaborated with esteemed professionals in the field, including colleagues such as Peijun Ding and Wei Wang. His partnerships with experts in the industry have led to the development of innovative solutions that push the boundaries of current technological capabilities.

Conclusion: William A Lanford's pioneering work in the realm of copper conductive layers reflects his dedication to driving innovation in the field of microelectronics. His patents not only showcase his technical prowess but also underscore his commitment to advancing the capabilities of electronic devices through cutting-edge research and development.

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