Windigsteig, Austria

Werner Weber

This inventor holds 1 USPTO granted patent. Top assignee: Eh-Schrack Components Aktiengesellschaft. Active years: 1997.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Werner Weber. Retrieved from https://idiyas.com/inventor/werner-weber-i3n4l3tm

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 1997

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1 patent (USPTO):Explore Patents

Title: Werner Weber: Innovator in Packaging Solutions

Introduction

Werner Weber is a notable inventor based in Windigsteig, Austria. He has made significant contributions to the field of packaging technology. His innovative approach has led to the development of a unique packaging solution that enhances the efficiency of receiving articles in a successive arrangement.

Latest Patents

Werner Weber holds a patent for a "Package for receiving articles in successive arrangement." This invention features an outer enclosure that defines an interior space, along with an insert designed to receive the articles. The insert includes at least one inside surface with an elevation that protrudes inwardly, allowing the projections of the articles to engage effectively within the enclosure. This design optimizes the arrangement and protection of the articles during storage and transport.

Career Highlights

Werner Weber is associated with Eh-Schrack Components Aktiengesellschaft, a company known for its innovative solutions in electrical components. His work at the company has allowed him to apply his inventive skills to real-world applications, contributing to advancements in packaging technology.

Conclusion

Werner Weber's contributions to packaging innovation demonstrate his commitment to improving efficiency in article handling. His patent reflects a thoughtful design that addresses practical challenges in the industry. His work continues to influence the field of packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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