Company Filing History:
Years Active: 1996
Title: Werner Hinter: Innovator in Printed Circuit Board Metallisation
Introduction
Werner Hinter is a notable inventor based in Wiesbaden, Germany. He has made significant contributions to the field of printed circuit board technology. His innovative approach has led to the development of a unique process for metallisation that enhances the functionality and reliability of circuit boards.
Latest Patents
Hinter holds a patent for a process titled "Process for the patterned metallisation of structured printed circuit." This patent describes a method where a fully structured printed circuit board is covered with a solder stop mask, leaving the solder contact locations exposed. The solder stop mask is then heated to a point where complete hardening does not occur, preventing oxidation of the copper surface. Metal is deposited from an aqueous bath at the exposed locations, and after the deposition, the mask is heated sufficiently to ensure complete hardening. This innovative process prevents solution infiltration under the mask during metallisation, ensuring strong adhesion.
Career Highlights
Werner Hinter has worked with Morton International, Inc., where he has applied his expertise in printed circuit board technology. His work has been instrumental in advancing the methods used in the industry, particularly in the area of metallisation processes.
Collaborations
Hinter has collaborated with notable colleagues, including Klaus Horn and Jurgen Lingnau. These partnerships have contributed to the development and refinement of his patented processes.
Conclusion
Werner Hinter's contributions to the field of printed circuit board metallisation demonstrate his innovative spirit and technical expertise. His patented process represents a significant advancement in the industry, showcasing the importance of innovation in technology.