Huizhou, China

Wenwu Liu

This inventor holds 1 USPTO granted patent. Top assignee: Huizhou Tcl Mobile Communication Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wenwu Liu. Retrieved from https://idiyas.com/inventor/wenwu-liu-4b2y8qwi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Wenwu Liu and a Head-Mounted Adjustment Device

Introduction

Wenwu Liu is an inventor associated with Huizhou, China, and Huizhou TCL Mobile Communication Co., Ltd. His listed patent work concerns an adjustment mechanism for a head-mounted display apparatus.

Latest Patents

Liu is credited with 1 patent: “Head-Mounted Adjustment Device and Head-Mounted Display Apparatus.” The invention describes a housing with an adjustment cavity and opening, a movable connecting rod, two magnetic members, and a strap. The strap connects to the rod and extends through the opening, allowing it to expand or contract as the rod moves. The magnetic members are arranged with like poles facing one another, forming part of the adjustment mechanism.

Career Highlights

The available information identifies Liu as an inventor on this patent and associates him with Huizhou TCL Mobile Communication Co., Ltd. The disclosed design focuses on adjusting a head-mounted device’s strap through a compact mechanism that combines movable components and magnetic elements.

Collaborations

The patent record connects Liu’s invention with Huizhou TCL Mobile Communication Co., Ltd. No additional collaborators are specified in the information provided.

Conclusion

Wenwu Liu’s listed patent presents a magnetic-assisted strap adjustment concept for head-mounted displays, reflecting his documented contribution to wearable-device design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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