Beijing, China

Wenwei Mo

USPTO Granted Patents = 4 

Average Co-Inventor Count = 3.8

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2024

where 'Filed Patents' based on already Granted Patents

4 patents (USPTO):

Title: The Innovative Contributions of Wenwei Mo

Introduction

Wenwei Mo is a notable inventor based in Beijing, China. He has made significant contributions to the field of technology, particularly in the area of lamination devices. With a total of 4 patents to his name, his work showcases a blend of creativity and technical expertise.

Latest Patents

Wenwei Mo's latest patents include a "Curved Surface Lamination Device" and a "Laminating Device and Laminating Method." The curved surface lamination device features a profiling jig that supports a carrier film and includes a base with an opening. This innovative design allows for efficient lamination processes. The laminating device is designed for laminating flexible panels with curved cover plates, incorporating a movable mechanism and elastic supporting members to ensure precision and stability during the lamination process.

Career Highlights

Throughout his career, Wenwei Mo has worked with prominent companies such as Chengdu BOE Optoelectronics Technology Co., Ltd. and BOE Technology Group Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technological advancements.

Collaborations

Wenwei Mo has collaborated with talented individuals in his field, including Wei Qing and Shaokui Liu. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Wenwei Mo's contributions to the field of lamination technology are noteworthy. His innovative patents and collaborations reflect his commitment to advancing technology. His work continues to influence the industry and inspire future innovations.

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