This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Alpha and Omega Semiconductor International LP. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Wenjun Li: Semiconductor Packaging Inventor.
Introduction
Wenjun Li is an inventor based in Portland, Oregon. His patent work concerns semiconductor packaging and lead-frame design. He is associated with Alpha and Omega Semiconductor International LP.
Latest Patents
Li is named on one patent, “Semiconductor Package Having Partially Plated Lead Flank and Method of Making the Same.” The invention describes a semiconductor package with a lead frame, a chip, and a molding encapsulation. Each lead includes a base member and a protrusion member, with the protrusion’s end surface narrower than half the width of the corresponding base member to improve solderability.
The disclosed manufacturing method includes providing a lead-frame array, mounting a chip, forming a molding encapsulation, cutting or punching the assembly, applying plating, and singulating the packages. Li’s record includes 1 patent.
Career Highlights
Li’s patent reflects work on semiconductor package construction and manufacturing processes. Its design focuses on lead geometry and plating to support solderability.
Collaborations
Li’s listed coworker is Yan Xun Xue. Both are associated with the patent concerning a partially plated lead flank.
Conclusion
Wenjun Li’s patent contribution addresses lead-frame design and fabrication techniques intended to improve solderability in semiconductor packages.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile